晶圆研磨GNX200BP晶圆背抛
——又称晶圆减薄/晶圆抛光（Wafer Grinding）
GNX200BP晶圆研磨/晶圆背抛概要
GNX200BP Wafer Grinding is a fully automatic continuous downfeed grinding machine. Two different stations are used for wafer cleaning after the final grind station.
GNX200BP晶圆研磨/晶圆背抛相关产品：
衡鹏供应
GDM300晶圆研磨/晶圆减薄/晶圆抛光/晶圆背抛/Wafer Grinding